Abstract
An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.
| Original language | English |
|---|---|
| Title of host publication | Micro Nano Devices, Structure and Computing Systems III |
| Publisher | Trans Tech Publications |
| Pages | 79-83 |
| Number of pages | 5 |
| ISBN (Print) | 9783038350750 |
| DOIs | |
| Publication status | Published - 2014 Jan 1 |
| Event | 3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014 - , Singapore Duration: 2014 Mar 1 → 2014 Mar 2 |
Publication series
| Name | Advanced Materials Research |
|---|---|
| Volume | 918 |
| ISSN (Print) | 1022-6680 |
Other
| Other | 3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014 |
|---|---|
| Country | Singapore |
| Period | 14/3/1 → 14/3/2 |
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Keywords
- Die bonding
- LED
- Mechanism
- Self-alignment
- Self-assembly
ASJC Scopus subject areas
- Engineering(all)
Cite this
Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. / Chang, Tien Li; Chang, Chieh Fu; Lee, Ya Wei; Cheng, Chun Hu; Chou, Cheng Ying; Huang, Meng Chi.
Micro Nano Devices, Structure and Computing Systems III. Trans Tech Publications, 2014. p. 79-83 (Advanced Materials Research; Vol. 918).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing
AU - Chang, Tien Li
AU - Chang, Chieh Fu
AU - Lee, Ya Wei
AU - Cheng, Chun Hu
AU - Chou, Cheng Ying
AU - Huang, Meng Chi
PY - 2014/1/1
Y1 - 2014/1/1
N2 - An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.
AB - An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.
KW - Die bonding
KW - LED
KW - Mechanism
KW - Self-alignment
KW - Self-assembly
UR - http://www.scopus.com/inward/record.url?scp=84901707666&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84901707666&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.918.79
DO - 10.4028/www.scientific.net/AMR.918.79
M3 - Conference contribution
AN - SCOPUS:84901707666
SN - 9783038350750
T3 - Advanced Materials Research
SP - 79
EP - 83
BT - Micro Nano Devices, Structure and Computing Systems III
PB - Trans Tech Publications
ER -