Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing

Tien Li Chang, Chieh Fu Chang, Ya Wei Lee, Chun Hu Cheng, Cheng Ying Chou, Meng Chi Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.

Original languageEnglish
Title of host publicationMicro Nano Devices, Structure and Computing Systems III
PublisherTrans Tech Publications
Pages79-83
Number of pages5
ISBN (Print)9783038350750
DOIs
Publication statusPublished - 2014 Jan 1
Event3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014 - , Singapore
Duration: 2014 Mar 12014 Mar 2

Publication series

NameAdvanced Materials Research
Volume918
ISSN (Print)1022-6680

Other

Other3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014
CountrySingapore
Period14/3/114/3/2

Fingerprint

Fluidics
Self assembly
Light emitting diodes
Flow of gases
Magnetism

Keywords

  • Die bonding
  • LED
  • Mechanism
  • Self-alignment
  • Self-assembly

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Chang, T. L., Chang, C. F., Lee, Y. W., Cheng, C. H., Chou, C. Y., & Huang, M. C. (2014). Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. In Micro Nano Devices, Structure and Computing Systems III (pp. 79-83). (Advanced Materials Research; Vol. 918). Trans Tech Publications. https://doi.org/10.4028/www.scientific.net/AMR.918.79

Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. / Chang, Tien Li; Chang, Chieh Fu; Lee, Ya Wei; Cheng, Chun Hu; Chou, Cheng Ying; Huang, Meng Chi.

Micro Nano Devices, Structure and Computing Systems III. Trans Tech Publications, 2014. p. 79-83 (Advanced Materials Research; Vol. 918).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chang, TL, Chang, CF, Lee, YW, Cheng, CH, Chou, CY & Huang, MC 2014, Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. in Micro Nano Devices, Structure and Computing Systems III. Advanced Materials Research, vol. 918, Trans Tech Publications, pp. 79-83, 3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014, Singapore, 14/3/1. https://doi.org/10.4028/www.scientific.net/AMR.918.79
Chang TL, Chang CF, Lee YW, Cheng CH, Chou CY, Huang MC. Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. In Micro Nano Devices, Structure and Computing Systems III. Trans Tech Publications. 2014. p. 79-83. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.918.79
Chang, Tien Li ; Chang, Chieh Fu ; Lee, Ya Wei ; Cheng, Chun Hu ; Chou, Cheng Ying ; Huang, Meng Chi. / Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. Micro Nano Devices, Structure and Computing Systems III. Trans Tech Publications, 2014. pp. 79-83 (Advanced Materials Research).
@inproceedings{a63d6ab0ce6c4e318f59e180089b870a,
title = "Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing",
abstract = "An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.",
keywords = "Die bonding, LED, Mechanism, Self-alignment, Self-assembly",
author = "Chang, {Tien Li} and Chang, {Chieh Fu} and Lee, {Ya Wei} and Cheng, {Chun Hu} and Chou, {Cheng Ying} and Huang, {Meng Chi}",
year = "2014",
month = "1",
day = "1",
doi = "10.4028/www.scientific.net/AMR.918.79",
language = "English",
isbn = "9783038350750",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications",
pages = "79--83",
booktitle = "Micro Nano Devices, Structure and Computing Systems III",

}

TY - GEN

T1 - Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing

AU - Chang, Tien Li

AU - Chang, Chieh Fu

AU - Lee, Ya Wei

AU - Cheng, Chun Hu

AU - Chou, Cheng Ying

AU - Huang, Meng Chi

PY - 2014/1/1

Y1 - 2014/1/1

N2 - An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.

AB - An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.

KW - Die bonding

KW - LED

KW - Mechanism

KW - Self-alignment

KW - Self-assembly

UR - http://www.scopus.com/inward/record.url?scp=84901707666&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84901707666&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.918.79

DO - 10.4028/www.scientific.net/AMR.918.79

M3 - Conference contribution

AN - SCOPUS:84901707666

SN - 9783038350750

T3 - Advanced Materials Research

SP - 79

EP - 83

BT - Micro Nano Devices, Structure and Computing Systems III

PB - Trans Tech Publications

ER -