Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing

Tien Li Chang, Chieh Fu Chang, Ya Wei Lee, Chun Hu Cheng, Cheng Ying Chou, Meng Chi Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.

Original languageEnglish
Title of host publicationMicro Nano Devices, Structure and Computing Systems III
PublisherTrans Tech Publications
Pages79-83
Number of pages5
ISBN (Print)9783038350750
DOIs
Publication statusPublished - 2014 Jan 1
Event3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014 - , Singapore
Duration: 2014 Mar 12014 Mar 2

Publication series

NameAdvanced Materials Research
Volume918
ISSN (Print)1022-6680

Other

Other3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014
CountrySingapore
Period14/3/114/3/2

Keywords

  • Die bonding
  • LED
  • Mechanism
  • Self-alignment
  • Self-assembly

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Chang, T. L., Chang, C. F., Lee, Y. W., Cheng, C. H., Chou, C. Y., & Huang, M. C. (2014). Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing. In Micro Nano Devices, Structure and Computing Systems III (pp. 79-83). (Advanced Materials Research; Vol. 918). Trans Tech Publications. https://doi.org/10.4028/www.scientific.net/AMR.918.79