@inproceedings{a63d6ab0ce6c4e318f59e180089b870a,
title = "Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing",
abstract = "An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.",
keywords = "Die bonding, LED, Mechanism, Self-alignment, Self-assembly",
author = "Chang, {Tien Li} and Chang, {Chieh Fu} and Lee, {Ya Wei} and Cheng, {Chun Hu} and Chou, {Cheng Ying} and Huang, {Meng Chi}",
year = "2014",
month = jan,
day = "1",
doi = "10.4028/www.scientific.net/AMR.918.79",
language = "English",
isbn = "9783038350750",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications",
pages = "79--83",
booktitle = "Micro Nano Devices, Structure and Computing Systems III",
note = "3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014 ; Conference date: 01-03-2014 Through 02-03-2014",
}