Design and implementation of a novel conical electrode for fast anodic bonding

Chii Rong Yang*, Jim Wei Wu, Long Yin Chang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)


Anodic bonding is a frequently used nonintermediate wafer-bonding technique for use in MEMS. However, it has a minimum bonding time for a 4 in silicon/glass wafer that is generally limited to the order of several minutes because of the gas-trapping problem that occurs in the bonded interface when a conventional bonding electrode is used. Therefore, the purpose of this study was to develop a novel conical bonding electrode, which shortens the bonding time and solves the gas-trapping problem of the bonded interface. The 4 in silicon/glass wafers fitted with the proposed electrode exhibited a bonding ratio of 99.89% and an average bonding strength of around 15 MPa, which was attained within 15 s, at a bonding voltage of 900 V and a bonding temperature of 400°C. A comprehensive series of experiments was performed to validate the excellent bonding performance of the proposed conical electrode.

Original languageEnglish
Article number105003
JournalJournal of Micromechanics and Microengineering
Issue number10
Publication statusPublished - 2014 Oct 1


  • anodic bonding technology
  • bonding strength
  • bubble-driven principle
  • conical bonding electrode
  • gas trapping; bonding ratio

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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