Design and implementation of a novel conical electrode for fast anodic bonding

Chii Rong Yang, Jim Wei Wu, Long Yin Chang

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Anodic bonding is a frequently used nonintermediate wafer-bonding technique for use in MEMS. However, it has a minimum bonding time for a 4 in silicon/glass wafer that is generally limited to the order of several minutes because of the gas-trapping problem that occurs in the bonded interface when a conventional bonding electrode is used. Therefore, the purpose of this study was to develop a novel conical bonding electrode, which shortens the bonding time and solves the gas-trapping problem of the bonded interface. The 4 in silicon/glass wafers fitted with the proposed electrode exhibited a bonding ratio of 99.89% and an average bonding strength of around 15 MPa, which was attained within 15 s, at a bonding voltage of 900 V and a bonding temperature of 400°C. A comprehensive series of experiments was performed to validate the excellent bonding performance of the proposed conical electrode.

Original languageEnglish
Article number105003
JournalJournal of Micromechanics and Microengineering
Volume24
Issue number10
DOIs
Publication statusPublished - 2014 Oct 1

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Keywords

  • anodic bonding technology
  • bonding strength
  • bubble-driven principle
  • conical bonding electrode
  • gas trapping; bonding ratio

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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