Depth measurement based on pixel number variation and Speeded Up Robust Features

Chen Chien Hsu, Po Ting Huang, Zhong Han Cai, Ming Chih Lu, Yin Yu Lu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a method for depth measurement based on Speeded Up Robust Features (SURF) and pixel number variation of CCD Images. A single camera is used to capture two images in different photographing distances, where features in the images are extracted and matched by SURF. To remove false matching points, an Identifying point correspondences by Correspondence Function (ICF) method is adopted to automatically select suitable reference points required for the pixel number variation method. Based on the displacement of the camera at two photographing distances, difference in pixel count between feature points of the objects in the images can be used to determine the photographing distance of the target objects for constructing the depth map.

Original languageEnglish
Title of host publicationProceedings 2014 IEEE 4th International Conference on Consumer Electronics - Berlin, ICCE-Berlin
EditorsFrancisco J. Bellido, Dietmar Hepper, Hans L. Cycon, Alexander Huhn
PublisherIEEE Computer Society
Pages228-229
Number of pages2
EditionFebruary
ISBN (Electronic)9781479961658
DOIs
Publication statusPublished - 2015 Feb 5
Event2014 4th IEEE International Conference on Consumer Electronics - Berlin, ICCE-Berlin - Berlin, Germany
Duration: 2014 Sept 72014 Sept 10

Publication series

NameIEEE International Conference on Consumer Electronics - Berlin, ICCE-Berlin
NumberFebruary
Volume2015-February
ISSN (Print)2166-6814
ISSN (Electronic)2166-6822

Other

Other2014 4th IEEE International Conference on Consumer Electronics - Berlin, ICCE-Berlin
Country/TerritoryGermany
CityBerlin
Period2014/09/072014/09/10

Keywords

  • Distance measurement
  • SURF
  • Speeded Up Robust Features
  • depth
  • digital camera
  • image-based measuring systems
  • pixel

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Media Technology

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