Abstract
A comparison of RTNO, N2O and N2O-ISSG ultrathin oxynitride gate dielectrics fabricated by combining a remote plasma nitridation (RPN) treatment with equal physical oxide thickness of 14 Å is explored. The N2O-ISSG oxynitride gate dielectric film demonstrates good interface properties, higher mobility and excellent reliability. This film by RPN treatment is thus attractive as the gate dielectric for future ultra-large scale integration (ULSI) devices.
| Original language | English |
|---|---|
| Pages (from-to) | 416-418 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 23 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2002 Jul |
| Externally published | Yes |
Keywords
- NO
- NO-ISSG
- Oxynitride
- RPN
- RTNO
- Ultrathin
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering