Abstract
A comparison of RTNO, N2O and N2O-ISSG ultrathin oxynitride gate dielectrics fabricated by combining a remote plasma nitridation (RPN) treatment with equal physical oxide thickness of 14 Å is explored. The N2O-ISSG oxynitride gate dielectric film demonstrates good interface properties, higher mobility and excellent reliability. This film by RPN treatment is thus attractive as the gate dielectric for future ultra-large scale integration (ULSI) devices.
Original language | English |
---|---|
Pages (from-to) | 416-418 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 23 |
Issue number | 7 |
DOIs | |
Publication status | Published - 2002 Jul |
Externally published | Yes |
Keywords
- NO
- NO-ISSG
- Oxynitride
- RPN
- RTNO
- Ultrathin
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering