Characterization of Quasi-Bound State in the Continuum Structures for Terahertz Band Applications

Fang Jou Wang, Yi An Wei, Bo Chien Peng, Chin Pao Cheng, Chan Shan Yang*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The Bound State in the Continuum (BIC) has gained widespread attention, yet conventional metasurfaces often suffer from significant Ohmic losses due to metallic structures. In contrast, our groundbreaking THz resonance modulator, crafted from pure PMMA and ceramic materials using advanced CNC machining, represents a novel approach. This digital manufacturing method allows unparalleled flexibility, resulting in high-quality THz modulators with superior performance and efficiency. By overcoming the limitations of metallic structures, our suspended grating structure achieves a high Q-factor, crucial for optimizing vibrational efficiency. This advancement marks a pivotal moment in THz technology, promising a bright future for applications in communication and sensing.

Original languageEnglish
Title of host publication2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2024
PublisherIEEE Computer Society
ISBN (Electronic)9798350370324
DOIs
Publication statusPublished - 2024
Event49th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2024 - Perth, Australia
Duration: 2024 Sept 12024 Sept 6

Publication series

NameInternational Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
ISSN (Print)2162-2027
ISSN (Electronic)2162-2035

Conference

Conference49th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2024
Country/TerritoryAustralia
CityPerth
Period2024/09/012024/09/06

Keywords

  • All-Dielectric
  • Bound States in the Continuum
  • Metasurface
  • Modulator
  • Pancharatnam-Berry (PB) phase
  • Polymer Composite Materials
  • Terahertz

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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