TY - GEN
T1 - Characterization of Quasi-Bound State in the Continuum Structures for Terahertz Band Applications
AU - Wang, Fang Jou
AU - Wei, Yi An
AU - Peng, Bo Chien
AU - Cheng, Chin Pao
AU - Yang, Chan Shan
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - The Bound State in the Continuum (BIC) has gained widespread attention, yet conventional metasurfaces often suffer from significant Ohmic losses due to metallic structures. In contrast, our groundbreaking THz resonance modulator, crafted from pure PMMA and ceramic materials using advanced CNC machining, represents a novel approach. This digital manufacturing method allows unparalleled flexibility, resulting in high-quality THz modulators with superior performance and efficiency. By overcoming the limitations of metallic structures, our suspended grating structure achieves a high Q-factor, crucial for optimizing vibrational efficiency. This advancement marks a pivotal moment in THz technology, promising a bright future for applications in communication and sensing.
AB - The Bound State in the Continuum (BIC) has gained widespread attention, yet conventional metasurfaces often suffer from significant Ohmic losses due to metallic structures. In contrast, our groundbreaking THz resonance modulator, crafted from pure PMMA and ceramic materials using advanced CNC machining, represents a novel approach. This digital manufacturing method allows unparalleled flexibility, resulting in high-quality THz modulators with superior performance and efficiency. By overcoming the limitations of metallic structures, our suspended grating structure achieves a high Q-factor, crucial for optimizing vibrational efficiency. This advancement marks a pivotal moment in THz technology, promising a bright future for applications in communication and sensing.
KW - All-Dielectric
KW - Bound States in the Continuum
KW - Metasurface
KW - Modulator
KW - Pancharatnam-Berry (PB) phase
KW - Polymer Composite Materials
KW - Terahertz
UR - http://www.scopus.com/inward/record.url?scp=85207219712&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85207219712&partnerID=8YFLogxK
U2 - 10.1109/IRMMW-THz60956.2024.10697676
DO - 10.1109/IRMMW-THz60956.2024.10697676
M3 - Conference contribution
AN - SCOPUS:85207219712
T3 - International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
BT - 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2024
PB - IEEE Computer Society
T2 - 49th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2024
Y2 - 1 September 2024 through 6 September 2024
ER -