Characterization of grain boundaries in YBa2Cu3Oy bicrystal junctions

Hsiao-Wen Yu Hsiao-Wen; Ming Jye Chen; Hong Chang Yang; S. Y. Yang; H. E. Horng

doi:10.1109/77.783685

Characterization of grain boundaries in YBa₂Cu₃O_y bicrystal junctions

Hsiao-Wen Yu Hsiao-Wen, Ming Jye Chen, Hong Chang Yang, S. Y. Yang, H. E. Horng

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

I-V, V-O characteristics and atomic force images of grain boundary Josephson junctions fabricated on SrTiO, bicrystal substrates were investigated. The half integer Shapiro steps and I, versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction. The dc SQUID formed on the grain boundary shows the expected V-O curve. The AFM images, R-T curves and IeRn product reveal sequential destructive deterioration of the junction originating from the underlying grooved substrate. The results are discussed.

Original language	English
Pages (from-to)	3101-3104
Number of pages	4
Journal	IEEE Transactions on Applied Superconductivity
Volume	9
Issue number	2 PART 3
DOIs	https://doi.org/10.1109/77.783685
Publication status	Published - 1999
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering

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title = "Characterization of grain boundaries in YBa2Cu3Oy bicrystal junctions",

abstract = "I-V, V-O characteristics and atomic force images of grain boundary Josephson junctions fabricated on SrTiO, bicrystal substrates were investigated. The half integer Shapiro steps and I, versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction. The dc SQUID formed on the grain boundary shows the expected V-O curve. The AFM images, R-T curves and IeRn product reveal sequential destructive deterioration of the junction originating from the underlying grooved substrate. The results are discussed.",

author = "{Yu Hsiao-Wen}, Hsiao-Wen and Chen, {Ming Jye} and Yang, {Hong Chang} and Yang, {S. Y.} and Horng, {H. E.}",

note = "Funding Information: Manuscript received September 15, 1998. This work is supported by the National Science Council of ROC under grants NSC87-2112-M-002-002, NSC87-2112-M-003-001 and NSC87-2112-M-003-008.",

year = "1999",

doi = "10.1109/77.783685",

language = "English",

volume = "9",

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TY - JOUR

T1 - Characterization of grain boundaries in YBa2Cu3Oy bicrystal junctions

AU - Yu Hsiao-Wen, Hsiao-Wen

AU - Chen, Ming Jye

AU - Yang, Hong Chang

AU - Yang, S. Y.

AU - Horng, H. E.

N1 - Funding Information: Manuscript received September 15, 1998. This work is supported by the National Science Council of ROC under grants NSC87-2112-M-002-002, NSC87-2112-M-003-001 and NSC87-2112-M-003-008.

PY - 1999

Y1 - 1999

N2 - I-V, V-O characteristics and atomic force images of grain boundary Josephson junctions fabricated on SrTiO, bicrystal substrates were investigated. The half integer Shapiro steps and I, versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction. The dc SQUID formed on the grain boundary shows the expected V-O curve. The AFM images, R-T curves and IeRn product reveal sequential destructive deterioration of the junction originating from the underlying grooved substrate. The results are discussed.

AB - I-V, V-O characteristics and atomic force images of grain boundary Josephson junctions fabricated on SrTiO, bicrystal substrates were investigated. The half integer Shapiro steps and I, versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction. The dc SQUID formed on the grain boundary shows the expected V-O curve. The AFM images, R-T curves and IeRn product reveal sequential destructive deterioration of the junction originating from the underlying grooved substrate. The results are discussed.

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JF - IEEE Transactions on Applied Superconductivity

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Characterization of grain boundaries in YBa₂Cu₃O_y bicrystal junctions

Abstract

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