Characteristics of noises in high-temperature YBCO Josephson junctions

Herng-Er Horng, Shieh-Yueh Yang, J. T. Jeng, J. M. Wu, J. H. Chen, Hong-Chang Yang

    Research output: Contribution to journalArticle

    1 Citation (Scopus)

    Abstract

    In this work, the characteristics of the noises for hightemperature YBCO Josephson junctions and SQUIDs were studied. The noise power spectrum densities showed complicated behaviors, which may be attributed to many causes. In order to realize the contributions of these causes to the noise, the noise power spectra were detected at various bias currents. Thus, the noises owing to the critical current fluctuation, resistance fluctuation or apparent flux motion can be investigated. By comparing these noise power spectra under the different conditions, the origins of the noises for the junctions and SQUIDs can be clarified.

    Original languageEnglish
    Pages (from-to)3986-3989
    Number of pages4
    JournalIEEE Transactions on Applied Superconductivity
    Volume9
    Issue number2 PART 3
    DOIs
    Publication statusPublished - 1999 Dec 1

    Fingerprint

    Power spectrum
    Josephson junctions
    noise spectra
    SQUIDs
    power spectra
    Bias currents
    Critical currents
    Temperature
    causes
    Fluxes
    critical current

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Cite this

    Characteristics of noises in high-temperature YBCO Josephson junctions. / Horng, Herng-Er; Yang, Shieh-Yueh; Jeng, J. T.; Wu, J. M.; Chen, J. H.; Yang, Hong-Chang.

    In: IEEE Transactions on Applied Superconductivity, Vol. 9, No. 2 PART 3, 01.12.1999, p. 3986-3989.

    Research output: Contribution to journalArticle

    Horng, Herng-Er ; Yang, Shieh-Yueh ; Jeng, J. T. ; Wu, J. M. ; Chen, J. H. ; Yang, Hong-Chang. / Characteristics of noises in high-temperature YBCO Josephson junctions. In: IEEE Transactions on Applied Superconductivity. 1999 ; Vol. 9, No. 2 PART 3. pp. 3986-3989.
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