Characteristics of high-Tc josephson junction fabricated by focused ION beam and ION damage

Chiu Hsien Wu, Wei Cheng Kuo, Yu Te Chou, Jau Han Chen, Hong-Chang Yang

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A high-Tc Josephson junction and superconducting quantum interference devices (SQUIDs) were fabricated by focused ion beam (FIB) milling and 150 keV oxygen ion implantation. A single layer gold mask with a small aperture of 28-73 nm defined by direct milling with FIB, was used. The voltage versus current characteristics of high-Tc YBa2Cu 3O7-x Josephson junctions were measured under microwaves. Shapiro steps were observed in the single junction. The voltage versus current and voltage versus magnetic field characteristics of a SQUID were measured.

Original languageEnglish
Article number5153032
Pages (from-to)210-213
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume19
Issue number3
DOIs
Publication statusPublished - 2009 Jun 1

Fingerprint

Focused ion beams
SQUIDs
Josephson junctions
damage
Electric potential
electric potential
Current voltage characteristics
ion beams
Ion implantation
Gold
interference
Masks
Microwaves
Magnetic fields
Oxygen
oxygen ions
ion implantation
masks
apertures
gold

Keywords

  • Focused ion beam
  • Ion implantation
  • Josephson junction
  • SQUID

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Characteristics of high-Tc josephson junction fabricated by focused ION beam and ION damage. / Wu, Chiu Hsien; Kuo, Wei Cheng; Chou, Yu Te; Chen, Jau Han; Yang, Hong-Chang.

In: IEEE Transactions on Applied Superconductivity, Vol. 19, No. 3, 5153032, 01.06.2009, p. 210-213.

Research output: Contribution to journalArticle

Wu, Chiu Hsien ; Kuo, Wei Cheng ; Chou, Yu Te ; Chen, Jau Han ; Yang, Hong-Chang. / Characteristics of high-Tc josephson junction fabricated by focused ION beam and ION damage. In: IEEE Transactions on Applied Superconductivity. 2009 ; Vol. 19, No. 3. pp. 210-213.
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