BICMOS devices under mechanical strain

C. W. Liu, S. Maikap, M. H. Liao, F. Yuan, M. H. Lee

Research output: Contribution to conferencePaper

4 Citations (Scopus)

Abstract

The drain current (Ids) enhancements of the strained-Si and control Si MOSFET devices under the external mechanical strain are investigated. The uniaxial tensile strain parallel (perpendicular) to the channel can enhance the drive current, while the compressive strain can reduce the drive current of the NMOS devices. The Ids of control Si NMOSFET with high-κ HfO2 gate dielectric can be further improved by the external strain. The biaxial tensile strain improves the drive current of NMOS devices. The uniaxial and biaxial tensile strain can reduce the current gain (β = I c/IB) of BJT and HBT devices, while the compressive strain can increase the current gain. The current gain change of the Si BJT and SiGe HBT devices under the external stress can be explained by the combinational effects of the mobility and the intrinsic carrier concentration due to the strain.

Original languageEnglish
Pages437-448
Number of pages12
Publication statusPublished - 2004 Dec 1
EventSiGe: Materials, Processing, and Devices - Proceedings of the First Symposium - Honolulu, HI, United States
Duration: 2004 Oct 32004 Oct 8

Other

OtherSiGe: Materials, Processing, and Devices - Proceedings of the First Symposium
CountryUnited States
CityHonolulu, HI
Period04/10/304/10/8

Fingerprint

Tensile strain
Heterojunction bipolar transistors
Gate dielectrics
Drain current
MOSFET devices
Carrier concentration

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Liu, C. W., Maikap, S., Liao, M. H., Yuan, F., & Lee, M. H. (2004). BICMOS devices under mechanical strain. 437-448. Paper presented at SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium, Honolulu, HI, United States.

BICMOS devices under mechanical strain. / Liu, C. W.; Maikap, S.; Liao, M. H.; Yuan, F.; Lee, M. H.

2004. 437-448 Paper presented at SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium, Honolulu, HI, United States.

Research output: Contribution to conferencePaper

Liu, CW, Maikap, S, Liao, MH, Yuan, F & Lee, MH 2004, 'BICMOS devices under mechanical strain', Paper presented at SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium, Honolulu, HI, United States, 04/10/3 - 04/10/8 pp. 437-448.
Liu CW, Maikap S, Liao MH, Yuan F, Lee MH. BICMOS devices under mechanical strain. 2004. Paper presented at SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium, Honolulu, HI, United States.
Liu, C. W. ; Maikap, S. ; Liao, M. H. ; Yuan, F. ; Lee, M. H. / BICMOS devices under mechanical strain. Paper presented at SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium, Honolulu, HI, United States.12 p.
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