Automated reconstruction of 3D object on embedded system for mobile apps

Yu Hsien Sung*, Kahlil Muchtar, Hsiang Erh Lai, Chia Hung Yeh, Chia Yen Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a light-weight 3D object reconstruction system is proposed. It aims to fulfill the increasing demand for fast and reliable 3D reconstruction in a mobile environment. Thereby, people can directly use their own device (e.g. mobile phone or tablet) to reconstruct desired objects into 3D models. The system is implemented and tested on an embedded board, MIO-5250, that is equipped with the recent Intel Atom N2600 series. With massive development of 3D technology, we believe the application proposed in this work would have rapidly expanding usages in the near future.

Original languageEnglish
Title of host publication2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages65-66
Number of pages2
ISBN (Electronic)9781479951451
DOIs
Publication statusPublished - 2014 Feb 3
Externally publishedYes
Event2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014 - Tokyo, Japan
Duration: 2014 Oct 72014 Oct 10

Publication series

Name2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014

Other

Other2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014
Country/TerritoryJapan
CityTokyo
Period2014/10/072014/10/10

Keywords

  • 3D reconstruction
  • embedded board
  • Structure from Motion (SfM)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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