Application of computational intelligence techniques for optimization of solder volume in PCB assembly

Hui Po Hsu; Jian Hung Wang; Li Fei Chen; Chao Ton Su

doi:10.1109/SAI.2017.8252265

Application of computational intelligence techniques for optimization of solder volume in PCB assembly

Hui Po Hsu
, Jian Hung Wang
, Li Fei Chen
, Chao Ton Su

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Application of insufficient or excessive amounts of the solder paste during the solder paste printing process can result in circuit issues, such as an incomplete circuit when the paste applied is insufficient and a short circuit when the paste applied is excessive. The former is resulting from a solder open; the latter is resulting from the forming of a solder bridge. This study attempts to optimize solder volume in a printed circuit board assembly. Computational intelligence techniques, including neural network, genetic algorithm, particle swarm optimization, and simulated annealing, were used to address this problem. A real case study was presented to confirm the effectiveness of the computational intelligence techniques.

Original language	English
Title of host publication	Proceedings of Computing Conference 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1347-1349
Number of pages	3
ISBN (Electronic)	9781509054435
DOIs	https://doi.org/10.1109/SAI.2017.8252265
Publication status	Published - 2018 Jan 8
Externally published	Yes
Event	2017 SAI Computing Conference 2017 - London, United Kingdom Duration: 2017 Jul 18 → 2017 Jul 20

Publication series

Name	Proceedings of Computing Conference 2017
Volume	2018-January

Conference

Conference	2017 SAI Computing Conference 2017
Country/Territory	United Kingdom
City	London
Period	2017/07/18 → 2017/07/20

Keywords

Computational intelligence
Genetic algorithm
Neural network
Particle swarm optimization
Printed circuit board
Simulated annealing

ASJC Scopus subject areas

Computer Networks and Communications
Computer Science Applications
Software
Artificial Intelligence

Access to Document

10.1109/SAI.2017.8252265

Cite this

Hsu, H. P., Wang, J. H., Chen, L. F., & Su, C. T. (2018). Application of computational intelligence techniques for optimization of solder volume in PCB assembly. In Proceedings of Computing Conference 2017 (pp. 1347-1349). (Proceedings of Computing Conference 2017; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SAI.2017.8252265

Application of computational intelligence techniques for optimization of solder volume in PCB assembly. / Hsu, Hui Po; Wang, Jian Hung; Chen, Li Fei et al.
Proceedings of Computing Conference 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1347-1349 (Proceedings of Computing Conference 2017; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hsu, HP, Wang, JH, Chen, LF & Su, CT 2018, Application of computational intelligence techniques for optimization of solder volume in PCB assembly. in Proceedings of Computing Conference 2017. Proceedings of Computing Conference 2017, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1347-1349, 2017 SAI Computing Conference 2017, London, United Kingdom, 2017/07/18. https://doi.org/10.1109/SAI.2017.8252265

@inproceedings{c96dadb5003042129f84e9ef41f909d8,

title = "Application of computational intelligence techniques for optimization of solder volume in PCB assembly",

abstract = "Application of insufficient or excessive amounts of the solder paste during the solder paste printing process can result in circuit issues, such as an incomplete circuit when the paste applied is insufficient and a short circuit when the paste applied is excessive. The former is resulting from a solder open; the latter is resulting from the forming of a solder bridge. This study attempts to optimize solder volume in a printed circuit board assembly. Computational intelligence techniques, including neural network, genetic algorithm, particle swarm optimization, and simulated annealing, were used to address this problem. A real case study was presented to confirm the effectiveness of the computational intelligence techniques.",

keywords = "Computational intelligence, Genetic algorithm, Neural network, Particle swarm optimization, Printed circuit board, Simulated annealing",

author = "Hsu, \{Hui Po\} and Wang, \{Jian Hung\} and Chen, \{Li Fei\} and Su, \{Chao Ton\}",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 SAI Computing Conference 2017 ; Conference date: 18-07-2017 Through 20-07-2017",

year = "2018",

month = jan,

day = "8",

doi = "10.1109/SAI.2017.8252265",

language = "English",

series = "Proceedings of Computing Conference 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1347--1349",

booktitle = "Proceedings of Computing Conference 2017",

}

TY - GEN

T1 - Application of computational intelligence techniques for optimization of solder volume in PCB assembly

AU - Hsu, Hui Po

AU - Wang, Jian Hung

AU - Chen, Li Fei

AU - Su, Chao Ton

PY - 2018/1/8

Y1 - 2018/1/8

N2 - Application of insufficient or excessive amounts of the solder paste during the solder paste printing process can result in circuit issues, such as an incomplete circuit when the paste applied is insufficient and a short circuit when the paste applied is excessive. The former is resulting from a solder open; the latter is resulting from the forming of a solder bridge. This study attempts to optimize solder volume in a printed circuit board assembly. Computational intelligence techniques, including neural network, genetic algorithm, particle swarm optimization, and simulated annealing, were used to address this problem. A real case study was presented to confirm the effectiveness of the computational intelligence techniques.

AB - Application of insufficient or excessive amounts of the solder paste during the solder paste printing process can result in circuit issues, such as an incomplete circuit when the paste applied is insufficient and a short circuit when the paste applied is excessive. The former is resulting from a solder open; the latter is resulting from the forming of a solder bridge. This study attempts to optimize solder volume in a printed circuit board assembly. Computational intelligence techniques, including neural network, genetic algorithm, particle swarm optimization, and simulated annealing, were used to address this problem. A real case study was presented to confirm the effectiveness of the computational intelligence techniques.

KW - Computational intelligence

KW - Genetic algorithm

KW - Neural network

KW - Particle swarm optimization

KW - Printed circuit board

KW - Simulated annealing

UR - https://www.scopus.com/pages/publications/85046035879

UR - https://www.scopus.com/pages/publications/85046035879#tab=citedBy

U2 - 10.1109/SAI.2017.8252265

DO - 10.1109/SAI.2017.8252265

M3 - Conference contribution

AN - SCOPUS:85046035879

T3 - Proceedings of Computing Conference 2017

SP - 1347

EP - 1349

BT - Proceedings of Computing Conference 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 SAI Computing Conference 2017

Y2 - 18 July 2017 through 20 July 2017

ER -

Application of computational intelligence techniques for optimization of solder volume in PCB assembly

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this