Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs

Chien Ping Wang, Tzung Te Chen, Han Kuei Fu, Tien-Li Chang, Pei Ting Chou, Mu Tao Chu

Research output: Contribution to journalArticle

32 Citations (Scopus)

Abstract

The purpose of this study is to investigate the thermal behavior at the die-attached interfaces of flip-chip GaN high-power light emitting diodes (LEDs) using a combination of theoretical and experimental analyses. The results indicate that contact thermal resistance increased dramatically at the die-attached interfaces with aging time and stress, degrading the luminous flux. The junction temperature and thermal uniformity of the flip-chip structure both strongly depend on the arrangement of gold bumps. Local hot spots effectively reduce light output under high electric and thermal stress, influencing the long-term performance of the LED device. The results were validated using finite element analysis and in experiments using an infrared and an emission microscope. A two-step thermal transient degradation mode was identified under various aging stresses. A simulation further optimized the bump configuration that was associated to yield a low junction temperature and high temperature uniformity of the LED chip. Accordingly, the results are helpful in enhancing the performance and reliability of high-power LEDs.

Original languageEnglish
Pages (from-to)698-703
Number of pages6
JournalMicroelectronics Reliability
Volume52
Issue number4
DOIs
Publication statusPublished - 2012 Apr 1

Fingerprint

Light emitting diodes
light emitting diodes
chips
degradation
Degradation
Aging of materials
thermal resistance
thermal stresses
Heat resistance
Thermal stress
Gold
Temperature
temperature
Microscopes
microscopes
gold
Fluxes
Infrared radiation
Finite element method
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs. / Wang, Chien Ping; Chen, Tzung Te; Fu, Han Kuei; Chang, Tien-Li; Chou, Pei Ting; Chu, Mu Tao.

In: Microelectronics Reliability, Vol. 52, No. 4, 01.04.2012, p. 698-703.

Research output: Contribution to journalArticle

Wang, Chien Ping ; Chen, Tzung Te ; Fu, Han Kuei ; Chang, Tien-Li ; Chou, Pei Ting ; Chu, Mu Tao. / Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs. In: Microelectronics Reliability. 2012 ; Vol. 52, No. 4. pp. 698-703.
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