Abstract
Although gold wire proposes the good characteristics such as malleability and stabilization, in the cost consideration to promote the package competition, the copper wire provides the better attraction. Therefore, the assembly houses gradually impress on the copper wire bonding technology desirably replacing the traditional gold wire bonding, especially in high-pin-count package. Besides the cost superiority, the electrical resistivity of copper, 1.7 μΩ-cm, is lower than that of gold, 2.2 μΩ-cm, and aluminum, 2.65 μΩ-cm. Furthermore, the mechanical characteristics of copper, such as Youngs modulus and rigidity modulus (130 GPa and 48 GPa, respectively), are larger than those of gold (78 GPa and 27 GPa, respectively). In copper wire bonding, the wire ball on pad demonstrates the excellent neck intensity and the arc shape of the copper wire is more stable. This superiority in molding process is singularly and significantly noticeable.
| Original language | English |
|---|---|
| Title of host publication | IMPACT Conference 2009 International 3D IC Conference - Proceedings |
| Pages | 108-111 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2009 |
| Event | IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan Duration: 2009 Oct 21 → 2009 Oct 23 |
Other
| Other | IMPACT Conference 2009 International 3D IC Conference |
|---|---|
| Country | Taiwan |
| City | Taipei |
| Period | 09/10/21 → 09/10/23 |
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ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
Analysis of promising copper wire bonding in assembly consideration. / Wang, Mu Chun; Hsieh, Zhen Ying; Huang, Kuo Shu; Liu, Chuan Hsi; Lin, Chii Ruey.
IMPACT Conference 2009 International 3D IC Conference - Proceedings. 2009. p. 108-111 5382168.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Analysis of promising copper wire bonding in assembly consideration
AU - Wang, Mu Chun
AU - Hsieh, Zhen Ying
AU - Huang, Kuo Shu
AU - Liu, Chuan Hsi
AU - Lin, Chii Ruey
PY - 2009
Y1 - 2009
N2 - Although gold wire proposes the good characteristics such as malleability and stabilization, in the cost consideration to promote the package competition, the copper wire provides the better attraction. Therefore, the assembly houses gradually impress on the copper wire bonding technology desirably replacing the traditional gold wire bonding, especially in high-pin-count package. Besides the cost superiority, the electrical resistivity of copper, 1.7 μΩ-cm, is lower than that of gold, 2.2 μΩ-cm, and aluminum, 2.65 μΩ-cm. Furthermore, the mechanical characteristics of copper, such as Youngs modulus and rigidity modulus (130 GPa and 48 GPa, respectively), are larger than those of gold (78 GPa and 27 GPa, respectively). In copper wire bonding, the wire ball on pad demonstrates the excellent neck intensity and the arc shape of the copper wire is more stable. This superiority in molding process is singularly and significantly noticeable.
AB - Although gold wire proposes the good characteristics such as malleability and stabilization, in the cost consideration to promote the package competition, the copper wire provides the better attraction. Therefore, the assembly houses gradually impress on the copper wire bonding technology desirably replacing the traditional gold wire bonding, especially in high-pin-count package. Besides the cost superiority, the electrical resistivity of copper, 1.7 μΩ-cm, is lower than that of gold, 2.2 μΩ-cm, and aluminum, 2.65 μΩ-cm. Furthermore, the mechanical characteristics of copper, such as Youngs modulus and rigidity modulus (130 GPa and 48 GPa, respectively), are larger than those of gold (78 GPa and 27 GPa, respectively). In copper wire bonding, the wire ball on pad demonstrates the excellent neck intensity and the arc shape of the copper wire is more stable. This superiority in molding process is singularly and significantly noticeable.
UR - http://www.scopus.com/inward/record.url?scp=77950793645&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950793645&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2009.5382168
DO - 10.1109/IMPACT.2009.5382168
M3 - Conference contribution
AN - SCOPUS:77950793645
SN - 9781424443413
SP - 108
EP - 111
BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings
ER -