Analysis of promising copper wire bonding in assembly consideration

Mu Chun Wang, Zhen Ying Hsieh, Kuo Shu Huang, Chuan Hsi Liu, Chii Ruey Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Although gold wire proposes the good characteristics such as malleability and stabilization, in the cost consideration to promote the package competition, the copper wire provides the better attraction. Therefore, the assembly houses gradually impress on the copper wire bonding technology desirably replacing the traditional gold wire bonding, especially in high-pin-count package. Besides the cost superiority, the electrical resistivity of copper, 1.7 μΩ-cm, is lower than that of gold, 2.2 μΩ-cm, and aluminum, 2.65 μΩ-cm. Furthermore, the mechanical characteristics of copper, such as Youngs modulus and rigidity modulus (130 GPa and 48 GPa, respectively), are larger than those of gold (78 GPa and 27 GPa, respectively). In copper wire bonding, the wire ball on pad demonstrates the excellent neck intensity and the arc shape of the copper wire is more stable. This superiority in molding process is singularly and significantly noticeable.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages108-111
Number of pages4
DOIs
Publication statusPublished - 2009
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 2009 Oct 212009 Oct 23

Other

OtherIMPACT Conference 2009 International 3D IC Conference
CountryTaiwan
CityTaipei
Period09/10/2109/10/23

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ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Wang, M. C., Hsieh, Z. Y., Huang, K. S., Liu, C. H., & Lin, C. R. (2009). Analysis of promising copper wire bonding in assembly consideration. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 108-111). [5382168] https://doi.org/10.1109/IMPACT.2009.5382168