A study to performance of electroplating solder bump in assembly

Mu Chun Wang; Kuo Shu Huang; Zhen Ying Hsieh; Hsin Chia Yang; Chuan Hsi Liu; Chii Ruey Lin

doi:10.1109/ICEPT.2010.5582692

A study to performance of electroplating solder bump in assembly

Mu Chun Wang^*, Kuo Shu Huang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

^*Corresponding author for this work

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eightstep process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.

Original language	English
Title of host publication	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages	794-797
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2010.5582692
Publication status	Published - 2010
Event	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China Duration: 2010 Aug 16 → 2010 Aug 19

Publication series

Name	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Country/Territory	China
City	Xi'an
Period	2010/08/16 → 2010/08/19

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICEPT.2010.5582692

Cite this

Wang, M. C., Huang, K. S., Hsieh, Z. Y., Yang, H. C., Liu, C. H., & Lin, C. R. (2010). A study to performance of electroplating solder bump in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 794-797). Article 5582692 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5582692

A study to performance of electroplating solder bump in assembly. / Wang, Mu Chun; Huang, Kuo Shu; Hsieh, Zhen Ying et al.
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 794-797 5582692 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, MC, Huang, KS, Hsieh, ZY, Yang, HC, Liu, CH & Lin, CR 2010, A study to performance of electroplating solder bump in assembly. in Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010., 5582692, Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, pp. 794-797, 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, 2010/08/16. https://doi.org/10.1109/ICEPT.2010.5582692

Wang MC, Huang KS, Hsieh ZY, Yang HC, Liu CH, Lin CR. A study to performance of electroplating solder bump in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 794-797. 5582692. (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). doi: 10.1109/ICEPT.2010.5582692

Wang, Mu Chun ; Huang, Kuo Shu ; Hsieh, Zhen Ying et al. / A study to performance of electroplating solder bump in assembly. Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. pp. 794-797 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

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abstract = "The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eightstep process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.",

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AB - The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eightstep process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.

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A study to performance of electroplating solder bump in assembly

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