A study to performance of electroplating solder bump in assembly

Mu Chun Wang, Kuo Shu Huang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan-Hsi Liu, Chii Ruey Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eightstep process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.

Original languageEnglish
Title of host publicationProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages794-797
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 24
Event2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China
Duration: 2010 Aug 162010 Aug 19

Publication series

NameProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
CountryChina
CityXi'an
Period10/8/1610/8/19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Wang, M. C., Huang, K. S., Hsieh, Z. Y., Yang, H. C., Liu, C-H., & Lin, C. R. (2010). A study to performance of electroplating solder bump in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 794-797). [5582692] (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5582692