A study of characteristics of halogen-free prevented solder materials

Mu Chun Wang; Tien Tsorng Shih; Bao Yi Lin; Hsin Chia Yang; Yaw Dong Wu; Chuan Hsi Liu

doi:10.1109/ICEPT-HDP.2012.6474579

A study of characteristics of halogen-free prevented solder materials

Mu Chun Wang^*, Tien Tsorng Shih, Bao Yi Lin, Hsin Chia Yang, Yaw Dong Wu, Chuan Hsi Liu

^*Corresponding author for this work

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.

Original language	English
Title of host publication	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
Pages	101-104
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT-HDP.2012.6474579
Publication status	Published - 2012
Event	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 - Guilin, China Duration: 2012 Aug 13 → 2012 Aug 16

Publication series

Name	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Other

Other	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Country/Territory	China
City	Guilin
Period	2012/08/13 → 2012/08/16

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ICEPT-HDP.2012.6474579

Cite this

Wang, M. C., Shih, T. T., Lin, B. Y., Yang, H. C., Wu, Y. D., & Liu, C. H. (2012). A study of characteristics of halogen-free prevented solder materials. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging (pp. 101-104). Article 6474579 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT-HDP.2012.6474579

A study of characteristics of halogen-free prevented solder materials. / Wang, Mu Chun; Shih, Tien Tsorng; Lin, Bao Yi et al.
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. p. 101-104 6474579 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, MC, Shih, TT, Lin, BY, Yang, HC, Wu, YD & Liu, CH 2012, A study of characteristics of halogen-free prevented solder materials. in ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging., 6474579, ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, pp. 101-104, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, Guilin, China, 2012/08/13. https://doi.org/10.1109/ICEPT-HDP.2012.6474579

Wang MC, Shih TT, Lin BY, Yang HC, Wu YD, Liu CH. A study of characteristics of halogen-free prevented solder materials. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. p. 101-104. 6474579. (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). doi: 10.1109/ICEPT-HDP.2012.6474579

Wang, Mu Chun ; Shih, Tien Tsorng ; Lin, Bao Yi et al. / A study of characteristics of halogen-free prevented solder materials. ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. pp. 101-104 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging).

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abstract = "Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.",

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A study of characteristics of halogen-free prevented solder materials

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