A study of characteristics of halogen-free prevented solder materials

Mu Chun Wang, Tien Tsorng Shih, Bao Yi Lin, Hsin Chia Yang, Yaw Dong Wu, Chuan-Hsi Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.

Original languageEnglish
Title of host publicationICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
Pages101-104
Number of pages4
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 - Guilin, China
Duration: 2012 Aug 132012 Aug 16

Publication series

NameICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Other

Other2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
CountryChina
CityGuilin
Period12/8/1312/8/16

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Wang, M. C., Shih, T. T., Lin, B. Y., Yang, H. C., Wu, Y. D., & Liu, C-H. (2012). A study of characteristics of halogen-free prevented solder materials. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging (pp. 101-104). [6474579] (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT-HDP.2012.6474579