A study of characteristics of halogen-free prevented solder materials

Mu Chun Wang, Tien Tsorng Shih, Bao Yi Lin, Hsin Chia Yang, Yaw Dong Wu, Chuan-Hsi Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.

Original languageEnglish
Title of host publicationICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
Pages101-104
Number of pages4
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 - Guilin, China
Duration: 2012 Aug 132012 Aug 16

Publication series

NameICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Other

Other2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
CountryChina
CityGuilin
Period12/8/1312/8/16

Fingerprint

Halogens
Soldering alloys
Lead
Surface roughness
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Wang, M. C., Shih, T. T., Lin, B. Y., Yang, H. C., Wu, Y. D., & Liu, C-H. (2012). A study of characteristics of halogen-free prevented solder materials. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging (pp. 101-104). [6474579] (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT-HDP.2012.6474579

A study of characteristics of halogen-free prevented solder materials. / Wang, Mu Chun; Shih, Tien Tsorng; Lin, Bao Yi; Yang, Hsin Chia; Wu, Yaw Dong; Liu, Chuan-Hsi.

ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. p. 101-104 6474579 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, MC, Shih, TT, Lin, BY, Yang, HC, Wu, YD & Liu, C-H 2012, A study of characteristics of halogen-free prevented solder materials. in ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging., 6474579, ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, pp. 101-104, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, Guilin, China, 12/8/13. https://doi.org/10.1109/ICEPT-HDP.2012.6474579
Wang MC, Shih TT, Lin BY, Yang HC, Wu YD, Liu C-H. A study of characteristics of halogen-free prevented solder materials. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. p. 101-104. 6474579. (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT-HDP.2012.6474579
Wang, Mu Chun ; Shih, Tien Tsorng ; Lin, Bao Yi ; Yang, Hsin Chia ; Wu, Yaw Dong ; Liu, Chuan-Hsi. / A study of characteristics of halogen-free prevented solder materials. ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. pp. 101-104 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging).
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