A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

Wan Lung Wu; Kung Chung Hsu; Wu Hsun Cheng

doi:10.1002/app.27599

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

Wan Lung Wu, Kung Chung Hsu^*, Wu Hsun Cheng

^*Corresponding author for this work

Department of Chemistry

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

A simple imide compound, 4-amino-phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4-nitrophthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H-NMR spectra. The thermal properties and dielectric constant (e) of a phosphorus-containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′-diamino diphenyl methane (DDM) or 4,4′-diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower 8 than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure.

Original language	English
Pages (from-to)	2052-2059
Number of pages	8
Journal	Journal of Applied Polymer Science
Volume	108
Issue number	3
DOIs	https://doi.org/10.1002/app.27599
Publication status	Published - 2008 Mar 5

Keywords

Additives
Dielectric properties
Resins
Synthesis
Thermal properties

ASJC Scopus subject areas

General Chemistry
Surfaces, Coatings and Films
Polymers and Plastics
Materials Chemistry

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10.1002/app.27599

Cite this

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abstract = "A simple imide compound, 4-amino-phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4-nitrophthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and 1H-NMR spectra. The thermal properties and dielectric constant (e) of a phosphorus-containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′-diamino diphenyl methane (DDM) or 4,4′-diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower 8 than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure.",

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author = "Wu, {Wan Lung} and Hsu, {Kung Chung} and Cheng, {Wu Hsun}",

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AU - Hsu, Kung Chung

AU - Cheng, Wu Hsun

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N2 - A simple imide compound, 4-amino-phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4-nitrophthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and 1H-NMR spectra. The thermal properties and dielectric constant (e) of a phosphorus-containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′-diamino diphenyl methane (DDM) or 4,4′-diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower 8 than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure.

AB - A simple imide compound, 4-amino-phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4-nitrophthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and 1H-NMR spectra. The thermal properties and dielectric constant (e) of a phosphorus-containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′-diamino diphenyl methane (DDM) or 4,4′-diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower 8 than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure.

KW - Additives

KW - Dielectric properties

KW - Resins

KW - Synthesis

KW - Thermal properties

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A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

Abstract

Keywords

ASJC Scopus subject areas

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