A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

Wan Lung Wu, Kung Chung Hsu, Wu Hsun Cheng

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

A simple imide compound, 4-amino-phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4-nitrophthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and 1H-NMR spectra. The thermal properties and dielectric constant (e) of a phosphorus-containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′-diamino diphenyl methane (DDM) or 4,4′-diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower 8 than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure.

Original languageEnglish
Pages (from-to)2052-2059
Number of pages8
JournalJournal of Applied Polymer Science
Volume108
Issue number3
DOIs
Publication statusPublished - 2008 Mar 5

Keywords

  • Additives
  • Dielectric properties
  • Resins
  • Synthesis
  • Thermal properties

ASJC Scopus subject areas

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

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