A Proposal of Hardware Channel Bonding for IEEE802.11N Wireless Network Using Raspberry PI

Rahardhita Widyatra Sudibyo, Nobuo Funabiki, Wen Chung Kao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Raspberry Pi has become popular around the world as a small-size, low-cost, low-power, and high-performance computing device. It can be used as a software access-point for IEEE802.11n wireless local-area networks. Unfortunately, only the software channel bonding is available where two independent 20MHz channels are used together for each link. In this paper, we present the configuration of Raspberry Pi for the hardware channel bonding to increase the capacity with 40MHz bandwidth. Because the built-in wireless NIC does not support it, the external adapter with USB3.0 is used together. To verify the performance, we conducted throughput measurements in two scenarios.

Original languageEnglish
Title of host publication2018 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781538663011
DOIs
Publication statusPublished - 2018 Aug 27
Event5th IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018 - Taichung, Taiwan
Duration: 2018 May 192018 May 21

Publication series

Name2018 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018

Conference

Conference5th IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018
CountryTaiwan
CityTaichung
Period18/5/1918/5/21

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ASJC Scopus subject areas

  • Biomedical Engineering
  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Sudibyo, R. W., Funabiki, N., & Kao, W. C. (2018). A Proposal of Hardware Channel Bonding for IEEE802.11N Wireless Network Using Raspberry PI. In 2018 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018 [8448498] (2018 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCE-China.2018.8448498