A non-fluorine mold release agent for Ni stamp in nanoimprint process

  • Tien Li Chang*
  • , Jung Chang Wang
  • , Chun Chi Chen
  • , Ya Wei Lee
  • , Ta Hsin Chou
    • *Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

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Material Science

Engineering