A non-fluorine mold release agent for Ni stamp in nanoimprint process

Tien-Li Chang, Jung Chang Wang, Chun Chi Chen, Ya Wei Lee, Ta Hsin Chou

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

This study presents a novel material as an anti-adhesive layer between Ni mold stamps and polymethyl methacrylate (PMMA) substrate in nanoimprint process. A polybenzoxazine ((6,6'-bis(2,3-dihydro-3-methyl-4H-1,3-benzoxazinyl))) molecule self-assembled monolayer (PBO-SAM) considering as anti-adhesive coating agent demonstrates that non-fluorine-containing compounds can be improve the nanoimprint process in Ni/PMMA substrates. In this work, the nanostructure-based Ni stamps and the imprinted PMMA mold are performed by electron-beam lithograph (EBL) and our homemade nanoimprint equipment, respectively. To control the forming of fabricated nanopatterns, the simulation can be analyzed their effect of temperature distributions on the deformation of PBO-SAM/PMMA substrate during hot embossing lithography (HEL) process. Herein the diameter of pillar patterns is 200 nm with and 400 nm pitch on Ni stamp surface. Based on the hydrophobic PBO-SAM surface in this conforming condition, the results of Ni mold stamps infer over 90% improvement in controlling quality and quantity.

Original languageEnglish
Pages (from-to)1608-1612
Number of pages5
JournalMicroelectronic Engineering
Volume85
Issue number7
DOIs
Publication statusPublished - 2008 Jul 1

Fingerprint

Mold release agents
Polymethyl Methacrylate
Polymethyl methacrylates
polymethyl methacrylate
adhesives
Adhesives
Substrates
embossing
Self assembled monolayers
Lithography
Electron beams
Nanostructures
Temperature distribution
temperature distribution
lithography
electron beams
coatings
Coatings
Molecules
molecules

Keywords

  • Anti-adhesive layer
  • Nano imprint
  • Ni stamp
  • Non-fluoride coatings
  • PBO-SAM

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

A non-fluorine mold release agent for Ni stamp in nanoimprint process. / Chang, Tien-Li; Wang, Jung Chang; Chen, Chun Chi; Lee, Ya Wei; Chou, Ta Hsin.

In: Microelectronic Engineering, Vol. 85, No. 7, 01.07.2008, p. 1608-1612.

Research output: Contribution to journalArticle

Chang, Tien-Li ; Wang, Jung Chang ; Chen, Chun Chi ; Lee, Ya Wei ; Chou, Ta Hsin. / A non-fluorine mold release agent for Ni stamp in nanoimprint process. In: Microelectronic Engineering. 2008 ; Vol. 85, No. 7. pp. 1608-1612.
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