A new paradigm for rule-based scheduling in the wafer probe centre

T. C. Chiang, Y. S. Shen, L. C. Fu

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

This paper addresses the scheduling problem in the wafer probe centre. The proposed approach is based on the dispatching rule, which is popularly used in the semiconductor manufacturing industry. Instead of designing new rules, this paper proposes a new paradigm to utilize these rules. The proposed paradigm formulates the dispatching process as a 2-D assignment problem with the consideration of information from multiple lots and multiple pieces of equipment in an integrated manner. Then, the dispatching decisions are made by maximizing the gains of multiple possible decisions simultaneously. Besides, we develop a genetic algorithm (GA) for generating good dispatching rules through combining multiple rules with linear weighted summation. The benefits of the proposed paradigm and GA are verified with a comprehensive simulation study on three due-date-based performance measures. The experimental results show that under the proposed paradigm, the dispatching rules and GA can perform much better than under the traditional paradigm.

Original languageEnglish
Pages (from-to)4111-4133
Number of pages23
JournalInternational Journal of Production Research
Volume46
Issue number15
DOIs
Publication statusPublished - 2008 Aug 1

Fingerprint

Genetic algorithms
Scheduling
Semiconductor materials
Rule-based
Paradigm
Industry
Dispatching rules
Genetic algorithm
Dispatching

Keywords

  • Dispatching rules
  • Paradigm
  • Scheduling
  • Wafer probe

ASJC Scopus subject areas

  • Strategy and Management
  • Management Science and Operations Research
  • Industrial and Manufacturing Engineering

Cite this

A new paradigm for rule-based scheduling in the wafer probe centre. / Chiang, T. C.; Shen, Y. S.; Fu, L. C.

In: International Journal of Production Research, Vol. 46, No. 15, 01.08.2008, p. 4111-4133.

Research output: Contribution to journalArticle

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