TY - JOUR
T1 - A miniature Q-band low noise amplifier using 0.13-μm CMOS technology
AU - Tsai, Jeng Han
AU - Chen, Wei Chien
AU - Wang, To Po
AU - Huang, Tian Wei
AU - Wang, Huei
N1 - Funding Information:
Manuscript received November 25, 2005; revised February 21, 2006. This work was supported by the National Science Council of Taiwan under Grants NSC 93-2752-E-002-001-PAE and NSC 94-2219-E-002-011, and by TSMC Semiconductors Corporation through the Chip Implementation Center (CIC), Taiwan, R.O.C.
PY - 2006/6
Y1 - 2006/6
N2 - A miniature Q-band low noise amplifier (LNA) using 0.13-μm standard mixed signal/radio frequency complementary metal-oxide-semiconductor (CMOS) technology is presented in this letter. This three-stage common source thin-film microstrip LNA achieves a peak gain of 20 dB at 43 GHz with a compact chip size of 0.525 mm 2. The 3-dB frequency bandwidth ranges from 34 to 44 GHz and the minimum noise figure is 6.3 dB at 41 GHz. The LNA outperforms all the reported commercial standard CMOS Q-band LNAs, with the highest gain, highest output IP3, and smallest chip size.
AB - A miniature Q-band low noise amplifier (LNA) using 0.13-μm standard mixed signal/radio frequency complementary metal-oxide-semiconductor (CMOS) technology is presented in this letter. This three-stage common source thin-film microstrip LNA achieves a peak gain of 20 dB at 43 GHz with a compact chip size of 0.525 mm 2. The 3-dB frequency bandwidth ranges from 34 to 44 GHz and the minimum noise figure is 6.3 dB at 41 GHz. The LNA outperforms all the reported commercial standard CMOS Q-band LNAs, with the highest gain, highest output IP3, and smallest chip size.
KW - Complementary metal-oxide-semiconductor (CMOS)
KW - Low noise amplifier (LNA)
KW - Millimeter-wave (MMW)
KW - Thin-film microstrip (TFMS)
UR - http://www.scopus.com/inward/record.url?scp=33746638077&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33746638077&partnerID=8YFLogxK
U2 - 10.1109/LMWC.2006.875628
DO - 10.1109/LMWC.2006.875628
M3 - Article
AN - SCOPUS:33746638077
SN - 1531-1309
VL - 16
SP - 327
EP - 329
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 6
M1 - 1637484
ER -