A high-voltage-tolerant stimulator realized in the low-voltage CMOS process for cochlear implant

Kuan Yu Lin, Ming Dou Ker, Chun Yu Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A biomedical stimulator with four high-voltagetolerant output channels, combined with on-chip positive high voltage generator, is proposed. For the purpose of integration with other circuit blocks into a system-on-chip (SoC) for cochlear implant biomedical applications, this design has been realized with the 1.8-V/3.3-V transistors in a 0.18-μm CMOS process. This stimulator only needs one single supply voltage of 1.8 V, but the maximum stimulation voltage can be as high as 7 V. The dynamic bias technique and stacked MOS configuration are used to implement this stimulator in the low-voltage CMOS process, without causing the issues of electrical overstress and gate-oxide reliability during circuit operation.

Original languageEnglish
Title of host publication2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages237-240
Number of pages4
ISBN (Print)9781479934324
DOIs
Publication statusPublished - 2014
Event2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014 - Melbourne, VIC, Australia
Duration: 2014 Jun 12014 Jun 5

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Other

Other2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
CountryAustralia
CityMelbourne, VIC
Period14/6/114/6/5

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'A high-voltage-tolerant stimulator realized in the low-voltage CMOS process for cochlear implant'. Together they form a unique fingerprint.

  • Cite this

    Lin, K. Y., Ker, M. D., & Lin, C. Y. (2014). A high-voltage-tolerant stimulator realized in the low-voltage CMOS process for cochlear implant. In 2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014 (pp. 237-240). [6865109] (Proceedings - IEEE International Symposium on Circuits and Systems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2014.6865109