A high-density, super-high-aspect-ratio microprobe array realized by high-frequency vibration assisted inverse micro w-EDM

Shun-Tong Chen, Shih Wei Yang

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This study is focused on the fabrication of a high-density, super-high-aspect-ratio microprobe array using high-frequency vibration assisted inverse micro w-EDM (wire electric discharge machining). An inverse micro w-EDM design in which a brass wire ϕ20 μm in diameter is located beneath the workpiece for bottom-up machining is devised. The wire is triggered to a high-frequency oscillation by a piezoelectric actuator thereby changing the flow regime of dielectric fluid and quickly sending out debris from the narrow spark-gap. The debris is rapidly removed via gravity decreasing debris concentration around the wire-electrode thereby reducing the probability of discharge-shorting and heat-accumulation. Combining magnetic force design and micro wire vibration-inhibition, wire-wriggling and wire-swaying are readily minimized. Three kinds of high-density, super-high-aspect-ratio microprobe arrays comprising: (1) straight-type, (2) wave-type, and (3) spanning-type are verified successfully. Studies show that each probe has highly consistent dimensional and form accuracy with aspect-ratio realized at104:1. Experimental results also demonstrate that processing time ‘with’ a high-frequency vibration assistance of 1.6 KHz is about 75–80% that of the time ‘without’ high-frequency vibration, validating inverse micro w-EDM with high-frequency vibration assistance enhancing machining efficiency of microstructure arrays. Additionally, the following aspects are evaluated in detail: wire-tension control, discharge energy, corner path designs, wire-running speed, vibration assistance effect, vibrational frequency, and side-erosion.

Original languageEnglish
Pages (from-to)144-155
Number of pages12
JournalJournal of Materials Processing Technology
Volume250
DOIs
Publication statusPublished - 2017 Dec 1

Fingerprint

Electric discharge machining
Machining
Aspect Ratio
Aspect ratio
Vibration
Wire
Debris
Magnetic Force
Piezoelectric Actuator
Erosion
Bottom-up
Straight
Electrode
Piezoelectric actuators
Microstructure
Fabrication
Gravity
Vibrational spectra
Probe
Heat

Keywords

  • High-frequency vibration assistance
  • Microprobe array
  • Super-high-aspect-ratio

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

Cite this

@article{6abd7a22a19744ea945817ebba5e90b1,
title = "A high-density, super-high-aspect-ratio microprobe array realized by high-frequency vibration assisted inverse micro w-EDM",
abstract = "This study is focused on the fabrication of a high-density, super-high-aspect-ratio microprobe array using high-frequency vibration assisted inverse micro w-EDM (wire electric discharge machining). An inverse micro w-EDM design in which a brass wire ϕ20 μm in diameter is located beneath the workpiece for bottom-up machining is devised. The wire is triggered to a high-frequency oscillation by a piezoelectric actuator thereby changing the flow regime of dielectric fluid and quickly sending out debris from the narrow spark-gap. The debris is rapidly removed via gravity decreasing debris concentration around the wire-electrode thereby reducing the probability of discharge-shorting and heat-accumulation. Combining magnetic force design and micro wire vibration-inhibition, wire-wriggling and wire-swaying are readily minimized. Three kinds of high-density, super-high-aspect-ratio microprobe arrays comprising: (1) straight-type, (2) wave-type, and (3) spanning-type are verified successfully. Studies show that each probe has highly consistent dimensional and form accuracy with aspect-ratio realized at104:1. Experimental results also demonstrate that processing time ‘with’ a high-frequency vibration assistance of 1.6 KHz is about 75–80{\%} that of the time ‘without’ high-frequency vibration, validating inverse micro w-EDM with high-frequency vibration assistance enhancing machining efficiency of microstructure arrays. Additionally, the following aspects are evaluated in detail: wire-tension control, discharge energy, corner path designs, wire-running speed, vibration assistance effect, vibrational frequency, and side-erosion.",
keywords = "High-frequency vibration assistance, Microprobe array, Super-high-aspect-ratio",
author = "Shun-Tong Chen and Yang, {Shih Wei}",
year = "2017",
month = "12",
day = "1",
doi = "10.1016/j.jmatprotec.2017.07.014",
language = "English",
volume = "250",
pages = "144--155",
journal = "Journal of Materials Processing Technology",
issn = "0924-0136",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - A high-density, super-high-aspect-ratio microprobe array realized by high-frequency vibration assisted inverse micro w-EDM

AU - Chen, Shun-Tong

AU - Yang, Shih Wei

PY - 2017/12/1

Y1 - 2017/12/1

N2 - This study is focused on the fabrication of a high-density, super-high-aspect-ratio microprobe array using high-frequency vibration assisted inverse micro w-EDM (wire electric discharge machining). An inverse micro w-EDM design in which a brass wire ϕ20 μm in diameter is located beneath the workpiece for bottom-up machining is devised. The wire is triggered to a high-frequency oscillation by a piezoelectric actuator thereby changing the flow regime of dielectric fluid and quickly sending out debris from the narrow spark-gap. The debris is rapidly removed via gravity decreasing debris concentration around the wire-electrode thereby reducing the probability of discharge-shorting and heat-accumulation. Combining magnetic force design and micro wire vibration-inhibition, wire-wriggling and wire-swaying are readily minimized. Three kinds of high-density, super-high-aspect-ratio microprobe arrays comprising: (1) straight-type, (2) wave-type, and (3) spanning-type are verified successfully. Studies show that each probe has highly consistent dimensional and form accuracy with aspect-ratio realized at104:1. Experimental results also demonstrate that processing time ‘with’ a high-frequency vibration assistance of 1.6 KHz is about 75–80% that of the time ‘without’ high-frequency vibration, validating inverse micro w-EDM with high-frequency vibration assistance enhancing machining efficiency of microstructure arrays. Additionally, the following aspects are evaluated in detail: wire-tension control, discharge energy, corner path designs, wire-running speed, vibration assistance effect, vibrational frequency, and side-erosion.

AB - This study is focused on the fabrication of a high-density, super-high-aspect-ratio microprobe array using high-frequency vibration assisted inverse micro w-EDM (wire electric discharge machining). An inverse micro w-EDM design in which a brass wire ϕ20 μm in diameter is located beneath the workpiece for bottom-up machining is devised. The wire is triggered to a high-frequency oscillation by a piezoelectric actuator thereby changing the flow regime of dielectric fluid and quickly sending out debris from the narrow spark-gap. The debris is rapidly removed via gravity decreasing debris concentration around the wire-electrode thereby reducing the probability of discharge-shorting and heat-accumulation. Combining magnetic force design and micro wire vibration-inhibition, wire-wriggling and wire-swaying are readily minimized. Three kinds of high-density, super-high-aspect-ratio microprobe arrays comprising: (1) straight-type, (2) wave-type, and (3) spanning-type are verified successfully. Studies show that each probe has highly consistent dimensional and form accuracy with aspect-ratio realized at104:1. Experimental results also demonstrate that processing time ‘with’ a high-frequency vibration assistance of 1.6 KHz is about 75–80% that of the time ‘without’ high-frequency vibration, validating inverse micro w-EDM with high-frequency vibration assistance enhancing machining efficiency of microstructure arrays. Additionally, the following aspects are evaluated in detail: wire-tension control, discharge energy, corner path designs, wire-running speed, vibration assistance effect, vibrational frequency, and side-erosion.

KW - High-frequency vibration assistance

KW - Microprobe array

KW - Super-high-aspect-ratio

UR - http://www.scopus.com/inward/record.url?scp=85024834985&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85024834985&partnerID=8YFLogxK

U2 - 10.1016/j.jmatprotec.2017.07.014

DO - 10.1016/j.jmatprotec.2017.07.014

M3 - Article

AN - SCOPUS:85024834985

VL - 250

SP - 144

EP - 155

JO - Journal of Materials Processing Technology

JF - Journal of Materials Processing Technology

SN - 0924-0136

ER -