3D printed high-entropy plasmonic structures for cutting-edge 6G modulation components on silicon wafers via electromagnetically induced reflection

Wei Hsiang Chen, Yu Sheng Chen, Pei Jung Wu, Chien Hua Chen, Chuan Feng Shih, Chan Shan Yang*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fingerprint

Dive into the research topics of '3D printed high-entropy plasmonic structures for cutting-edge 6G modulation components on silicon wafers via electromagnetically induced reflection'. Together they form a unique fingerprint.

Material Science

Engineering

INIS