子計畫四：次世代無線通訊晶片之靜電放電防護技術開發

Next-generation wireless communication ICs will be implemented in advanced CMOS or FinFET technologies. However, the nanoscale IC technologies seriously degrade the electrostatic discharge (ESD) robustness of electronics products. The ESD protection design must be equipped for all electronics products. The ESD protection designs for electronics products will continuously be an important design task. To enhance the reliability of circuits and systems, this project will develop the techniques of ESD protection design to solve the reliability issues which are concerned in the next-generation wireless communication ICs.