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Min-Hung Lee

  • 1849 Citations
  • 25 h-Index
19982020

Research output per year

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Research Output

Correlation between ferroelectricity and nitrogen incorporation of undoped hafnium dioxide thin films

Luo, J. D., Yeh, Y. T., Lai, Y. Y., Wu, C. F., Chung, H. T., Li, Y. S., Chuang, K. C., Li, W. S., Chen, P. G., Lee, M. H. & Cheng, H. C., 2020 Jun, In : Vacuum. 176, 109317.

Research output: Contribution to journal › Article

    • Double Layers Omega FETs with Ferroelectric HfZrO2 for One-Transistor Memory

    Chen, K. T., Lo, C., Lin, Y. Y., Chueh, C. Y., Chang, C., Siang, G. Y., Tseng, Y. Y., Yang, Y. J., Hsieh, F. C., Chang, S. H., Liang, H., Chiang, S. H., Liu, J. H., Lin, Y. Y., Yeh, P. C., Wang, C. Y., Yang, H. Y., Tzeng, P. J., Liao, M. H., Chang, S. T. & 2 others, Tseng, Y. Y. & Lee, M. H., 2020 Apr, 2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 9129088. (IEEE International Reliability Physics Symposium Proceedings; vol. 2020-April).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • The Demonstration of 3-D Bi2.0Te2.7Se0.3/Bi0.4Te3.0Sb1.6 Thermoelectric Devices by Ionized Sputter System

    Liao, M. H., Huang, K. C., Su, W. J., Chen, S. C. & Lee, M. H., 2020 Jan, In : IEEE Transactions on Electron Devices. 67, 1, p. 406-408 3 p., 8906168.

    Research output: Contribution to journal › Article

    • The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance

    Liao, M. H., Lu, P. Y., Su, W. J., Chen, S. C., Hung, H. T., Kao, C. R., Pu, W. C., Chen, C. C. A. & Lee, M. H., 2020 May, In : IEEE Transactions on Electron Devices. 67, 5, p. 2205-2207 3 p., 9042868.

    Research output: Contribution to journal › Article

    • 3D Scalable, Wake-up Free, and Highly Reliable FRAM Technology with Stress-Engineered HfZrOx

    Lin, Y. D., Tang, Y. T., Sheu, S. S., Hou, T. H., Lo, W. C., Lee, M. H., Chang, M. F., King, Y. C., Lin, C. J., Lee, H. Y., Yeh, P. C., Yang, H. Y., Yeh, P. S., Wang, C. Y., Su, J. W. & Li, S. H., 2019 Dec, 2019 IEEE International Electron Devices Meeting, IEDM 2019. Institute of Electrical and Electronics Engineers Inc., 8993504. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2019-December).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution