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Dive into the research topics where Chun-Yu Lin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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子計畫四：前瞻資料鏈結收發機之靜電放電防護
2021/08/01 → 2024/07/31
Project: Government Ministry › Ministry of Science and Technology
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子計畫四：高可靠之全晶片靜電放電防護技術
2020/08/01 → 2021/10/31
Project: Government Ministry › Ministry of Science and Technology
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物聯網晶片之靜電放電防護技術開發(I)
2019/08/01 → 2020/10/31
Project: Government Ministry › Ministry of Science and Technology
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創新無線通訊晶片之靜電放電防護技術開發(I)
2018/08/01 → 2019/07/31
Project: Government Ministry › Ministry of Science and Technology
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應用於高速電路之創新靜電放電防護技術開發(3/3)
2018/02/01 → 2019/01/31
Project: Government Ministry › Ministry of Science and Technology
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π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
Chang, C. R., Dai, Z. J. & Lin, C. Y., 2023 Apr, In: Materials. 16, 7, 2562.Research output: Contribution to journal › Article › peer-review
Open Access -
ESD Protection Design for Fan-Out Panel-Level Packaging
Lin, C. Y., Hsieh, C. Y., Dai, Z. J. & Lai, Y. H., 2022, International EOS/ESD Symposium on Design and System, IEDS 2022. Institute of Electrical and Electronics Engineers Inc., (International EOS/ESD Symposium on Design and System, IEDS 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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RC-diode ESD protection design for high-frequency applications
Lin, C. Y. & Fu, Y. Q., 2022 Feb, In: Solid-State Electronics. 188, 108222.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Study of RC-Diode ESD Protection Circuit for High-Frequency Applications
Lin, C. Y., Li, B. Y. & Fu, Y. Q., 2022, International EOS/ESD Symposium on Design and System, IEDS 2022. Institute of Electrical and Electronics Engineers Inc., (International EOS/ESD Symposium on Design and System, IEDS 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Compact ESD Protection Cell for Multi-Band Millimeter-Wave Applications
Lin, C. Y., Fu, Y. Q. & Wang, J. Y., 2020 Jan, In: IEEE Microwave and Wireless Components Letters. 30, 1, p. 58-61 4 p., 8947990.Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus)